JPH0475316B2 - - Google Patents

Info

Publication number
JPH0475316B2
JPH0475316B2 JP60115391A JP11539185A JPH0475316B2 JP H0475316 B2 JPH0475316 B2 JP H0475316B2 JP 60115391 A JP60115391 A JP 60115391A JP 11539185 A JP11539185 A JP 11539185A JP H0475316 B2 JPH0475316 B2 JP H0475316B2
Authority
JP
Japan
Prior art keywords
plating
nickel
solution
reaction
core material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP60115391A
Other languages
English (en)
Japanese (ja)
Other versions
JPS61276979A (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP60115391A priority Critical patent/JPS61276979A/ja
Publication of JPS61276979A publication Critical patent/JPS61276979A/ja
Publication of JPH0475316B2 publication Critical patent/JPH0475316B2/ja
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1655—Process features
    • C23C18/1662—Use of incorporated material in the solution or dispersion, e.g. particles, whiskers, wires
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
    • C23C18/34—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
    • C23C18/36—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents using hypophosphites

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Dispersion Chemistry (AREA)
  • Chemically Coating (AREA)
JP60115391A 1985-05-30 1985-05-30 ニッケルめっき材料の製造法 Granted JPS61276979A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60115391A JPS61276979A (ja) 1985-05-30 1985-05-30 ニッケルめっき材料の製造法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60115391A JPS61276979A (ja) 1985-05-30 1985-05-30 ニッケルめっき材料の製造法

Publications (2)

Publication Number Publication Date
JPS61276979A JPS61276979A (ja) 1986-12-06
JPH0475316B2 true JPH0475316B2 (en]) 1992-11-30

Family

ID=14661385

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60115391A Granted JPS61276979A (ja) 1985-05-30 1985-05-30 ニッケルめっき材料の製造法

Country Status (1)

Country Link
JP (1) JPS61276979A (en])

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6421082A (en) * 1987-07-15 1989-01-24 Nippon Chemical Ind Production of powdery plated material
US5170009A (en) * 1990-03-22 1992-12-08 Canon Kabushiki Kaisha Electrically conductive covers and electrically conductive covers of electronic equipment
US5234558A (en) * 1990-03-22 1993-08-10 Canon Kabushiki Kaisha Electrically conductive circuit member, method of manufacturing the same and electrically conductive paste
US5186802A (en) * 1990-03-22 1993-02-16 Canon Kabushiki Kaisha Electro-deposition coated member and process for producing it
US5676812A (en) * 1990-03-24 1997-10-14 Canon Kabushiki Kaisha Electronic equipment with an adhesive member to intercept electromagnetic waves
CN103736994B (zh) * 2014-01-15 2015-11-18 南京德磊科技有限公司 一种化学镀镍溶液的处理方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1403197A (en) * 1971-09-30 1975-08-28 Bell & Howell Co Metal encapsulation
JPS56119703A (en) * 1980-02-13 1981-09-19 Matsushita Electric Ind Co Ltd Production of nickel-coated finely grained particles
JPS6059070A (ja) * 1983-09-12 1985-04-05 Nippon Chem Ind Co Ltd:The 粉粒体メツキ品の製造法

Also Published As

Publication number Publication date
JPS61276979A (ja) 1986-12-06

Similar Documents

Publication Publication Date Title
CN108728835A (zh) 一种表面镀银材料的制备方法
US20050227074A1 (en) Conductive electrolessly plated powder and method for making same
JPH07118866A (ja) 分散性に優れた球状無電解めっき粉末、導電性材料およびその製造方法
JPH0696771B2 (ja) 無電解めっき粉末並びに導電性フィラーおよびその製造方法
JPH0475316B2 (en])
JPH0225431B2 (en])
JP2602495B2 (ja) ニツケルめつき材料の製造法
CN108213415B (zh) 耐腐蚀耐高温银铜包覆粉的生产方法
JP3905014B2 (ja) 導電性無電解めっき粉体及びその製造方法
JPH0249390B2 (en])
JP3210096B2 (ja) ニッケル合金めっきされた粉末及びその製造方法
US20050227073A1 (en) Conductive electrolessly plated powder and method for making same
JP2004131800A (ja) 導電性無電解めっき粉体及びその製造方法
JP2004323962A (ja) 導電性無電解めっき粉体及びその製造方法
JPS62107073A (ja) 貴金属めっき材料の製造法
JP4247039B2 (ja) 導電性無電解めっき粉体の製造方法
JP2619266B2 (ja) 着色無電解めっき粉末及びその製造法
TW201641698A (zh) 經銀塗佈之銅薄片及其製造方法
JPH0215176A (ja) 磁性無電解めっき粉体の製造方法
JPS60162779A (ja) 銀メッキ粉体及びその製造方法
JPS6369704A (ja) 安定化赤リンおよびその製造方法
KR100547605B1 (ko) 도전성 무전해 도금 분체 및 그 제조방법
JP2000149941A (ja) アルカリ二次電池用水酸化ニッケル粉末の製造方法
KR101239391B1 (ko) 입도 제어가 용이한 전자소재용 미세 구리 분말 제조 방법
CN119657939A (zh) 一种银包铝粉及其制备方法

Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term